Research output per year
Research output per year
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Dive into the research topics where Abdurrahman Öz is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I., Öz, A., Reichl, H., Lang, K. D. & Henke, H., 1 Apr 2015, In: IEEE Transactions on Electromagnetic Compatibility. 57, 2, p. 241-249 9 p., 6990557.Research output: Contribution to journal › Article › peer-review
36 Citations (Scopus) -
Electrical modeling of the power delivery to an LED array packaged in a textile
Curran, B., Öz, A., Linz, T., Ndip, I., Guttowski, S. & Lang, K. D., 2013, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. p. 116-121 6 p. 6724403. (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
Open Access -
Modeling and minimizing the inductance of bond wire interconnects
Ndip, I., Oz, A., Guttowski, S., Reichl, H., Lang, K. D. & Henke, H., 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558344. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
23 Citations (Scopus) -
Bond wire antennas for compact RF microsystems
Ndip, I., Öz, A., Tschoban, C., Schmitz, S., Guttowski, S., Schneider-Ramelow, M., Reichl, H. & Lang, K. D., 2012.Research output: Contribution to conference › Paper › peer-review
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Characterization of interconnects and RF components on glass interposers
Ndip, I., Töpper, M., Löbbicke, K., Öz, A., Guttowski, S., Reichl, H. & Lang, K. D., 2012, p. 770-780. 11 p.Research output: Contribution to conference › Paper › peer-review
8 Citations (Scopus)