Electrical modeling of the power delivery to an LED array packaged in a textile

Brian Curran; Abdurrahman Öz; Torsten Linz; Ivan Ndip; Stephan Guttowski; Klaus Dieter Lang

doi:10.1109/EDAPS.2013.6724403

Electrical modeling of the power delivery to an LED array packaged in a textile

Brian Curran, Abdurrahman Öz, Torsten Linz, Ivan Ndip, Stephan Guttowski, Klaus Dieter Lang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Recent technologies enable large arrays of LEDs to be integrated into textiles, which has applications in the lighting industry. Two analytical modeling techniques are proposed that calculate the supply power at a source necessary to provide the LED drivers with a minimum voltage. The modeling techniques show a correlation with numerical simulations to within 10% but can be implemented for very large LED arrays where, for time constraints, numerical simulations become impractical. The modeling allows a designer to optimize the location of the supply voltage, which can reduce the increase in voltage over the ideal voltage by 40%.

Original language	English
Title of host publication	EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
Pages	116-121
Number of pages	6
DOIs	https://doi.org/10.1109/EDAPS.2013.6724403
Publication status	Published - 2013
Externally published	Yes
Event	2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara, Japan Duration: 12 Dec 2013 → 15 Dec 2013

Publication series

Name	EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

Conference

Conference	2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Country/Territory	Japan
City	Nara
Period	12/12/13 → 15/12/13

Access to Document

10.1109/EDAPS.2013.6724403

Cite this

Curran, B., Öz, A., Linz, T., Ndip, I., Guttowski, S., & Lang, K. D. (2013). Electrical modeling of the power delivery to an LED array packaged in a textile. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (pp. 116-121). Article 6724403 (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium). https://doi.org/10.1109/EDAPS.2013.6724403

@inproceedings{f6df2ef19d214a62ba6ed69eb1accf0a,

title = "Electrical modeling of the power delivery to an LED array packaged in a textile",

abstract = "Recent technologies enable large arrays of LEDs to be integrated into textiles, which has applications in the lighting industry. Two analytical modeling techniques are proposed that calculate the supply power at a source necessary to provide the LED drivers with a minimum voltage. The modeling techniques show a correlation with numerical simulations to within 10% but can be implemented for very large LED arrays where, for time constraints, numerical simulations become impractical. The modeling allows a designer to optimize the location of the supply voltage, which can reduce the increase in voltage over the ideal voltage by 40%.",

author = "Brian Curran and Abdurrahman {\"O}z and Torsten Linz and Ivan Ndip and Stephan Guttowski and Lang, {Klaus Dieter}",

year = "2013",

doi = "10.1109/EDAPS.2013.6724403",

language = "English",

isbn = "9781479923113",

series = "EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium",

pages = "116--121",

booktitle = "EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium",

note = "2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 ; Conference date: 12-12-2013 Through 15-12-2013",

}

Curran, B, Öz, A, Linz, T, Ndip, I, Guttowski, S & Lang, KD 2013, Electrical modeling of the power delivery to an LED array packaged in a textile. in EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium., 6724403, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium, pp. 116-121, 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013, Nara, Japan, 12/12/13. https://doi.org/10.1109/EDAPS.2013.6724403

Electrical modeling of the power delivery to an LED array packaged in a textile. / Curran, Brian; Öz, Abdurrahman; Linz, Torsten et al.
EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 116-121 6724403 (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Electrical modeling of the power delivery to an LED array packaged in a textile

AU - Curran, Brian

AU - Öz, Abdurrahman

AU - Linz, Torsten

AU - Ndip, Ivan

AU - Guttowski, Stephan

AU - Lang, Klaus Dieter

PY - 2013

Y1 - 2013

N2 - Recent technologies enable large arrays of LEDs to be integrated into textiles, which has applications in the lighting industry. Two analytical modeling techniques are proposed that calculate the supply power at a source necessary to provide the LED drivers with a minimum voltage. The modeling techniques show a correlation with numerical simulations to within 10% but can be implemented for very large LED arrays where, for time constraints, numerical simulations become impractical. The modeling allows a designer to optimize the location of the supply voltage, which can reduce the increase in voltage over the ideal voltage by 40%.

AB - Recent technologies enable large arrays of LEDs to be integrated into textiles, which has applications in the lighting industry. Two analytical modeling techniques are proposed that calculate the supply power at a source necessary to provide the LED drivers with a minimum voltage. The modeling techniques show a correlation with numerical simulations to within 10% but can be implemented for very large LED arrays where, for time constraints, numerical simulations become impractical. The modeling allows a designer to optimize the location of the supply voltage, which can reduce the increase in voltage over the ideal voltage by 40%.

UR - http://www.scopus.com/inward/record.url?scp=84894147007&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2013.6724403

DO - 10.1109/EDAPS.2013.6724403

M3 - Conference contribution

AN - SCOPUS:84894147007

SN - 9781479923113

T3 - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

SP - 116

EP - 121

BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

T2 - 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013

Y2 - 12 December 2013 through 15 December 2013

ER -

Electrical modeling of the power delivery to an LED array packaged in a textile

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this