Modeling and minimizing the inductance of bond wire interconnects

Ivan Ndip, Abdurrahman Oz, Stephan Guttowski, Herbert Reichl, Klaus Dieter Lang, Heino Henke

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

23 Citations (Scopus)

Abstract

In this paper, a novel analytical model for calculating the partial self-inductance of bond wires in dependent on bonding parameters such as loop height, distance between bonding positions and the thickness of the metallization on which the wire is bonded, is derived for the first time. An excellent correlation is obtained between inductances extracted using our proposed model and those extracted using Ansys Q3D, with a maximum deviation of approximately 1%. Furthermore, methods for minimizing the inductance of bond wires, based on the definitions of loop and partial inductances are discussed. Test bond wire structures are designed, fabricated and measured to quantify the implemented method.

Original languageEnglish
Title of host publication2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013 - Paris, France
Duration: 12 May 201315 May 2013

Publication series

Name2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013

Conference

Conference2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013
Country/TerritoryFrance
CityParis
Period12/05/1315/05/13

Fingerprint

Dive into the research topics of 'Modeling and minimizing the inductance of bond wire interconnects'. Together they form a unique fingerprint.

Cite this