TY - GEN
T1 - Modeling and minimizing the inductance of bond wire interconnects
AU - Ndip, Ivan
AU - Oz, Abdurrahman
AU - Guttowski, Stephan
AU - Reichl, Herbert
AU - Lang, Klaus Dieter
AU - Henke, Heino
PY - 2013
Y1 - 2013
N2 - In this paper, a novel analytical model for calculating the partial self-inductance of bond wires in dependent on bonding parameters such as loop height, distance between bonding positions and the thickness of the metallization on which the wire is bonded, is derived for the first time. An excellent correlation is obtained between inductances extracted using our proposed model and those extracted using Ansys Q3D, with a maximum deviation of approximately 1%. Furthermore, methods for minimizing the inductance of bond wires, based on the definitions of loop and partial inductances are discussed. Test bond wire structures are designed, fabricated and measured to quantify the implemented method.
AB - In this paper, a novel analytical model for calculating the partial self-inductance of bond wires in dependent on bonding parameters such as loop height, distance between bonding positions and the thickness of the metallization on which the wire is bonded, is derived for the first time. An excellent correlation is obtained between inductances extracted using our proposed model and those extracted using Ansys Q3D, with a maximum deviation of approximately 1%. Furthermore, methods for minimizing the inductance of bond wires, based on the definitions of loop and partial inductances are discussed. Test bond wire structures are designed, fabricated and measured to quantify the implemented method.
UR - http://www.scopus.com/inward/record.url?scp=84881536997&partnerID=8YFLogxK
U2 - 10.1109/SaPIW.2013.6558344
DO - 10.1109/SaPIW.2013.6558344
M3 - Conference contribution
AN - SCOPUS:84881536997
SN - 9781467356787
T3 - 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013
BT - 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013
T2 - 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013
Y2 - 12 May 2013 through 15 May 2013
ER -